首页|资源下载
登录|注册

您现在的位置是:电子研发网 > 资源下载 > 高速电路PCB过孔优化的仿真

高速电路PCB过孔优化的仿真

资 源 简 介

针对高速背板的过孔Stub效应设计了几种优化方法:对单过孔,采用高速布线中换层尽量远或采用背钻工艺以减少Stub效应对信号的影响;对差分过孔,在差分过孔旁边打一对地过孔和对差分残段进行背钻处理以减少Stub效应对信号的影响.利用HFSS建立三维模型以验证方法的有效性,仿真结果表明,本文方法消除了过孔Stub效应、改善了信道的信号质量.

Several optimization methods are studied for via-holes, high speed route or back drill technology is high speed backboard Stub effect. For single utilized to reduce the via-hole stub effect on signals. For difference via-holes, a pair of terra via-holes beside difference via-holes and back drill process for difference stub is used three-dimensional model is built by demonstrate that via-hole stub effect to reduce the via-hole stub way of HFSS to validate the is eliminated and the quality effect on signals. In this paper, a effectiveness. Experimental results of signal is improved.

相 关 资 源